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Material

Heat conducting metal

Tungsten Copper Alloy

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    Electronic encapsulation materials

  • High heat conductivity, can quickly to the heat generated by the export electronic device

  • Semiconductor materials that match the thermal expansion coefficient (2 ~ 6 W/m.K), avoid and electronic device interface of thermal stress and thermal fatigue

  • Containing a large number of high hardness ceramic or metal particles, difficult processing

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    Solution

  • Powder injection molding (tungsten copper, kovar alloy, invar alloy, aluminum and silicon carbide, aluminum nitride, etc.)

  • Interface structure control, and improve the thermal performance


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Application of MIM Process:

    can direct sintering: tungsten copper alloy, kovar alloy, invar alloy, aluminum nitride

    aluminized after sintering: aluminum and silicon carbide, copper - diamond


Tungsten-copper alloy - Advantages: Tungsten-copper alloy

    High strength

    High proportion

    High temperature resistant

    Arc ablation resistance

    Conductive electric performance is good

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Tungsten copper alloy - Purpose:

    Military high temperature resistant material

    5g optical material

    Electrical alloy used in high pressure switch

    Machining electrode

    Microelectronics materials


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